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Please contact us at:0755-88265467
WG's Anti-Counterfeit Testing Lab boasts wel-equipped facilitiesand an experienced professiona team across these three locations.
Complete Testing Items
• Documentation and packaging
• General external visual inspection
• Detailed external visual inspection
• Remarking and Resurfacing
• X-RAY Inspection
• Lead finish evaluation
• Delid/Decapsulation internal analysis
Professional Testing Personnel
• Documentation and packaging
• General external visual inspection
• Detailed external visual inspection
• Remarking and Resurfacing
• X-RAY Inspection
• Lead finish evaluation
• Delid/Decapsulation internal analysis
Efficient Testing Services
• Documentation and packaging
• General external visual inspection
• Detailed external visual inspection
• Remarking and Resurfacing
• X-RAY Inspection
• Lead finish evaluation
• Delid/Decapsulation internal analysis
We provide you with high-quality component supply services through strict quality control procedures


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ABOUT QUALITY CONTROL
Nondestructive Testing

Nondestructive testing encompasses an array of examination approaches with a proven record of not adversely affecting a component's performance or dependability.These techniques serve to detect markings, voids, and other irregularities within or on components.

Destructive Testing

Destructive testing represents the final stage in R&A's procedure for confirming legitimacy. In certain cases, more invasive techniques, such as decapsulation and lead solderability testing, could be necessary to validate the authenticity of a product.

  • Over electrical stress (EOS) failure

    Power surges, load effects, overexcitation, electromagnetic induction, etc. exceed the specified maximum rating, resulting in irreversible changes to the product. It is usually divided into over-voltage stress and over- current stress.
  • Electrostatic ESD failure

    In the role of over-electrical stress, electronic components local hot spot formation, when the local hot spot temperature reaches the melting point of the material so that the material melts, forming an open circuit or short circuit, resulting in component burnout.
  • Functional failure due to circuit design matching

    Mainly due to the formation of interference effects between the device and the capacitive and inductive devices in the circuit, resulting in parameter shifts (intermittent or permanent).
  • Background investigation before failure analysis of electronic components

    Reasons for Failure
    Stress characteristics: failure phenomenon, product status, geographical characteristics
    Time characteristics: time of failure (R&D? Production? Market? Occasional: continuous occurrence?) The time of failure, the time of use, etc.
    Quantitative characteristics: failure rate and distribution
    System characteristics: product operating environment, input/output characteristics, associated impact circuits
    Event characteristics: failure-related process, technology, materials, equipment, management, personnel changes, etc.
    Interest behind the event: whether there is a relationship of interest
  • Information and materials required for Failure Analysis

    Datasheet
    Failure sample 1-3pcs, normal sample 1-2pcs, PCBA
    Components:2pcs(Same Lot)
    Product Device Related Circuit Diagrams、PCB GERBER
    Product input and output load information, as well as test-related wire or load
    Failure background questionnaire

In addition to the above standards, WG can provide other anti-counterfeiting tests according to specific customer requirements.
Contact us to learn more about our anti-counterfeiting testing services.

Other Testing Services Contact Us
Please contact us at:0755-88265467
Please contact us at:0755-88265467